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Direct, sequential growth of copper film on TaN/Ta barrier substrates by alternation of Pb-UPD and Cu-SLRR

Fang, J.S. ; Chen, J.H. ; Chen, G.S. ; Cheng, Y.L. ; Chin, T.S.

Electrochimica Acta, July 10, 2016, Vol.206, p.45(7) [Peer Reviewed Journal]

Cengage Learning, Inc.

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Direct, sequential growth of copper film on TaN/Ta barrier substrates by alternation of Pb-UPD and Cu-SLRR.(Report)

Fang, J.S. ; Chen, J.H. ; Chen, G.S. ; Cheng, Y.L. ; Chin, T.S.

Electrochimica Acta, July 10, 2016, Vol.206, p.45 [Peer Reviewed Journal]

Cengage Learning, Inc.

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Direct, sequential growth of copper film on TaN/Ta barrier substrates by alternation of Pb-UPD and Cu-SLRR
Material Type:
Article
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Direct, sequential growth of copper film on TaN/Ta barrier substrates by alternation of Pb-UPD and Cu-SLRR

Fang, J.S. ; Chen, J.H. ; Chen, G.S. ; Cheng, Y.L. ; Chin, T.S.

Electrochimica Acta, 07/2016, Vol.206, C, pp.45-51 [Peer Reviewed Journal]

Elsevier (via CrossRef)

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Direct, sequential growth of copper film on TaN/Ta barrier substrates by alternation of Pb-UPD and Cu-SLRR

Fanga, J ; Chena, J ; Chenb, G ; Chengc, Y ; Chinb, T Fanga, J (correspondence author)

Electrochimica Acta, July 10, 2016, Vol.206, pp.45-51 [Peer Reviewed Journal]

© ProQuest LLC All rights reserved

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Direct, sequential growth of copper film on TaN/Ta barrier substrates by alternation of Pb-UPD and Cu-SLRR

Fang, J.S ; Chen, J.H ; Chen, G.S ; Cheng, Y.L ; Chin, T.S

Electrochimica Acta, 10 July 2016, Vol.206, pp.45-51 [Peer Reviewed Journal]

ScienceDirect Journals (Elsevier)

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