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Results 1 - 10 of 1,176  for Great Falls College MSU

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Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
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Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging 1990

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2
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Electrical performance of electronic packaging : November 2-4, 1994, Monterey Plaza Hotel, Monterey, California

IEEE Microwave Theory and Techniques Society Content Provider; Components, Packaging & Manufacturing Technology Society Content Provider 1994

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3
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Electrical performance of electronic packaging : October 27-29, 1997, The Wyndham Hotel, San Jose, California

IEEE Microwave Theory and Techniques Society Content Provider; Components, Packaging & Manufacturing Technology Society Content Provider 1997

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4
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Electrical performance of electronic packaging : October 26-28, 1998, The Hotel Thayer, West Point, New York

IEEE Microwave Theory and Techniques Society Content Provider; Components, Packaging & Manufacturing Technology Society Content Provider 1998

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5
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Electrical performance of electronic packaging : October 2-4, 1995, the Benson Hotel, Portland, Oregon

IEEE Microwave Theory and Techniques Society Content Provider; Components, Packaging & Manufacturing Technology Society Content Provider 1995

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6
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1996 IEEE Electrical Performance of Electronic Packaging

Components, Packaging & Manufacturing Technology Society Content Provider; IEEE Microwave Theory and Techniques Society Content Provider 1996

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7
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Proceedings of 2nd Electronic Packaging Technology Conference : [8-10 December, 1998, Raffles City Convention Center, Singapore

Electronic Packaging Technology Conference Corporate Author Tay, Andrew A. O Contributor; Lim, Thiam Beng Contributor; IEEE Reliability/CPMT/ED Singapore Chapter Content Provider; Electronic Packaging Technology Conference 1998

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8
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Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 15-18, 1998

International Symposium on Advanced Packaging Materials Corporate Author Wong, C. P Contributor; International Microelectronics and Packaging Society Content Provider; International Symposium on Advanced Packaging Materials 1998

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9
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International Symposium on Advanced Packaging Materials : processes, properties and interfaces : proceedings : Chateau Elan, Braselton, Georgia, March 14-17, 1999

International Symposium on Advanced Packaging Materials Corporate Author Wong, C. P Contributor; International Microelectronics and Packaging Society Content Provider 1999

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10
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IWIPP proceedings : IEEE International Workshop on Integrated Power Packaging : the Congress Plaza Hotel, Chicago, Illinois, USA, September 17-19, 1998

IEEE International Workshop on Integrated Power Packaging Corporate Author Components, Packaging & Manufacturing Technology Society Content Provider; IEEE International Workshop on Integrated Power Packaging 1998

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